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Features
Common Specs
Product Specs
Package Dim. / Pin Config
Specification of Tape and Reel
Suggested Land Pattern
Reflow Soldering Conditions
Typical Applications
Output Waveforms
RoHS Compliance Status





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CDAD Surface-Mount High-Speed Differential Delay Lines

The CDAD family of high-speed differential delay lines are available in surface-mount (SMD) packaging in either standard or custom specification.


Features

  • Miniaturized high-speed differential delay lines that combine ELMEC's high-density delay line elements in the same surface-mount package as the CDA family of single fixed SMD delay line.
  • Suitable for use with a variety of logic elements including the ECLinPS, ECL 100KH, 10K series as well as TTL FAST, CMOS FACT and analog circuits.
  • The CDAD family of differential delay lines are cased in the exact same package and footprint so that it can be inserted onto the CDA family land pattern.

Common Specifications

Impedance: single-ended: 50 W ±10%
differential: 100 W ±10%
Waveform Distortion: Overshoot/preshoot under 20%
Temperature Coefficient: 0~150ppm/°C
Insulation Resistance: DC50V, over 100M W
Durable Voltage: DC50V, 1 minute
Operating Temperature Range: -40°C to +85°C
Storage Temperature Range: -40°C to +120°C


CDAD Product Specifications

Part Number Delay Time Delay
Difference
Rise Time
(20-80% Max)
-3 dB Passband (Minimum) DC Resistance
CDAD0105 100ps ±50ps 15ps Max 150ps Max 2GHz Min 1.5W Max
CDAD0205 200ps ±50ps
CDAD0305 300ps ±50ps
CDAD0405 400ps ±50ps
CDAD0505 500ps ±50ps
CDAD0605 600ps ±50ps 200ps Max 1.5GHz Min
CDAD0705 700ps ±50ps
CDAD0805 800ps ±50ps
CDAD0905 900ps ±50ps
CDAD1005 1.0ns ±50ps
CDAD1105 1.1ns ±50ps 20ps Max 250ps Max 1.1GHz Min 2.0W Max
CDAD1205 1.2ns ±50ps
CDAD1305 1.3ns ±50ps
CDAD1405 1.4ns ±50ps 2.5W Max
CDAD1505 1.5ns ±50ps
CDAD1605 1.6ns ±50ps 300ps Max 800MHz Min
CDAD1705 1.7ns ±50ps 3.0W Max
CDAD1805 1.8ns ±50ps
CDAD1905 1.9ns ±50ps
CDAD2005 2.0ns ±50ps


Package Dimensions & Pin Configuration




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CDA and CDAD type Tape and Reel specifications

Packaging of components can be in Tape and Reel to protect the pins from bending and for convenience of shipping and storage. The package is embossed with cover tape and contains 500pcs per reel, as shown below. The reel is marked with supplier name, part number, quantities, and lot number.


Guide hole








No 1 pin


Direction of Feed

Dimensions of Tape

Unit:mm(inch)



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Dimensions of Reel

Unit:mm(inch)



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Suggested Land Pattern



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Reflow Soldering Conditions

ELMEC does not guarantee MSL Standards Classification. Please bake all components prior to reflow.
Baking Conditions: 80°C for 100 hours

Conventional Produccts

Maximum Reflow Cycles:1


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Lead-Free

Maximum Reflow Cycles: 2
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Typical Applications and Termination Methods


(1) ECL (-2V termination line used)



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(2) PECL



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(3) ECL LVPECL



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(4) Twisted Pair Termination



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(5) LVDS



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Note: The Delay Line can be used with the GND disconnected, however, in order to obtain superior performance, we recommend that all GND pins should be connected.


Measurement Conditions for Waveform Plot




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Output Waveforms


CDAD0505

Output waveform (Step function)


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Amplitude / Frequency


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Output waveform (2GHz Clock)


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Group Delay


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CDAD1005

Output waveform (Step function)


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Amplitude / Frequency


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Output waveform (1GHz Clock)


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Group Delay


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CDAD1505

Output waveform (Step function)


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Amplitude / Frequency


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Output waveform (667MHz Clock)


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Group Delay


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CDAD2005

Output waveform (Step function)


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Amplitude / Frequency


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Output waveform (500MHz Clock)


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Group Delay


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RoHS Compliance Status


1. Compliance Status

Completed. However, if RoHS-compliant components are not specified at the time of order, non-compliant stock items may be supplied until depleted.

2. Differentiating Compliant and Non-compliant Components

Compliant and Non-compliant Components will be differentiated by Lot Numbers.
Non-compliant Components: 2-digit year/month code
Compliant Components: S+2-digit year/month code (3-digit code)

3. Terminal Plating

Non-compliant Components: Base: 99% Ni/1% B, 1.2~1.6µm
External: 60% Sn/40% Pb, over 5µm

Compliant Components: Base: 100% Ni, 0.2~0.5µm
External: 100% Sn, 5~10µm

 

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