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Features
Common Specs
Product Specs
Package Dim. / Pin Config
Specification of Tape and Reel
Suggested Land Pattern
Reflow Soldering Conditions
Typical Applications
Output Waveforms
RoHS Compliance Status





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Reflow Soldering Conditions

ELMEC does not guarantee MSL Standards Classification. Please bake all components prior to reflow.
Baking Conditions: 120°C, 24 hours; or 80°C, 100 hours
However, because baking of T&R parts is not possible, transferring to trays is recommended prior to baking.

Non-RoHS-compliant components

Maximum Reflow Cycles:1


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RoHS-compliant components

Maximum Reflow Cycles: 2
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