Reflow Soldering Conditions

Storage conditions are as per MSL-2. These conditions, however, are only to help preserve the terminal coating. These component families are not moisture-sensitive. Baking prior to reflow is not required.

J-STD-020C Pb-Free Standard

Printable Version - High Resolution PDF

1875 South Grant Street, Suite 570 ~ San Mateo, CA 94402 USA
(650) 212-4744 ~ sales@elmectech.com