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Package Dimensions & Pin Configurations
Unit:mm(inch)
Printable Version - High Resolution PDF
Application Notes:
Make adjustments of delay time at the rising portion of the output waveform.
A heat sink is provided on the top surface of the device.
IN and OUT pins are buffered by ECL gates.
Be sure to match the impedance of external parts when terminating the IN and ADDRESS pins.
Since the internal parts are not hermetically sealed, be sure to exercise due caution in cleaning.
We recommend hand soldering this part following completion of the standard soldering process.
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1875 South Grant Street, Suite 570 ~ San Mateo, CA 94402 USA ~ (650) 212-4744 ~
sales@elmectech.com
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